Research facilities

We are affiliated with both the Soft Hybrid Materials Research Center and the Convergence Research Center for Solutions to Electromagnetic Interference in Future Mobility (SEIF), and we possess world-class research facilities and equipment for application research based on two-dimensional materials and various composite materials.

Materials Characterization

FE SEM

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Field-Emission Scanning Electron Microscope (FE-SEM)

ZEISS Gemini Sigma 300

High-resolution field-emission scanning electron microscope capable of nanoscale surface imaging.
This system enables detailed morphological analysis of thin films, nanostructures, and 2D materials with excellent spatial resolution.

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X-ray Photoelectron Spectroscopy (XPS)

Thermo Scientific K-Alpha

High-resolution surface analysis system for elemental and chemical state characterization.
Essential for investigating surface functional groups, oxidation states, and interface chemistry in 2D materials and thin-film devices.

Thin Film Deposition

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Electron Beam Evaporation System

KVE-2006 E-Beam Evaporator

High-vacuum thin-film deposition system using electron beam evaporation.
Enables precise deposition of high-purity metal films for electrodes, contact layers, and nanoelectronic device fabrication.

Sputter

E-beam evap.

Sputter

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RF Magnetron Sputtering System

MS TECH MS-2006 RF Magnetron Sputtering System

Thin-film deposition system for metal and dielectric layers using RF magnetron sputtering. Enables uniform and high-quality film growth for device fabrication and materials research.

Electrical Characterization

T-variable vacuum probe station

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Vacuum Probe Station System

MS TECH Vacuum Chamber Probe Station + Keysight B1500A

A vacuum probe station integrated with a semiconductor parameter analyzer for precise electrical characterization of micro/nano devices.
Enables I–V, transfer, and output characteristic measurements under controlled vacuum conditions, minimizing environmental effects on sensitive materials.

Micro/Nanofabrication

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2D Material Transfer & Stamping System

Oasis Systems Micromanipulator Transfer Stage

Micromanipulator-based system for precise transfer and alignment of 2D materials onto target substrates.
Enables controlled stamping and layer stacking for device fabrication.

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Maskless Lithography System

PLANCK INC Direct Laser Writing System

Laser-based maskless lithography system for high-resolution micro-pattern fabrication.
Enables flexible and rapid prototyping of electrode patterns and device architectures without the need for photomasks.

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Reactive Ion Etching (RIE) System

FEMTO SCIENCE VITA Reactive Ion Etcher

Plasma-based dry etching system for precise micro- and nano-scale pattern transfer.
Enables controlled anisotropic etching of thin films for device fabrication and surface engineering.